I will be presenting at the 2018 TechConnect World Innovation Conference

I will be presenting at the 2018 TechConnect World Innovation Conference. Title: ¬†Mechanical reliability of fused deposition modeled polymers and compositesAuthors: O. Keles, E.H. Anderson Day: Wednesday, May 16Time: 11:10 AM Venue: Anaheim Convention Center, Anaheim, California, U.S.A. This title may be found in the general online program, or you may find it in the […]

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