I will be presenting at the 2018 TechConnect World Innovation Conference

Post by: siteadmin
March 3, 2018
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I will be presenting at the 2018 TechConnect World Innovation Conference.

Title: Mechanical reliability of fused deposition modeled polymers and composites
Authors: O. Keles, E.H. Anderson

Day: Wednesday, May 16
Time: 11:10 AM

Venue: Anaheim Convention Center, Anaheim, California, U.S.A.

This title may be found in the general online program, or you may find it in the Symposium assignment here: https://www.techconnectworld.com/World2018/sym/3D_Printing.html

Figure: Change in mechanical behavior of FDMed porous polymers with the raster orientation a) 45/45 degree default, b) biomimetic Bouligand structure 20 degree raster orientation change in each layer, and c) helical raster optimized for tensile loading.

Posted 3rd March 2018 by Ozgur Keles

Categories: Uncategorized